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Artech House USA
Lumped Elements for RF and Microwave Circuits

Lumped Elements for RF and Microwave Circuits

By (author): Inder J. Bahl
Copyright: 2003
Pages: 512
ISBN: 9781580533096

Print Book $138.00 Qty:
eBook $138.00 Qty:
Due to the unprecedented growth in wireless applications over the past decade, development of low-cost solutions for RF and microwave communication systems has become of great importance. This practical new book is the first comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The books offers you an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Supported with over 220 equations and more than 200 illustrations, it covers the practical aspects of each element in exceptional detail. No other single volume treats this subject matter in such depth. From materials, fabrication, and analyses - to design, modeling, and physical, electrical, and thermal applications, this unique resource offers you complete coverage of the critical topics you need understand for your work in the field. Offering the most comprehensive, up-to-date body of knowledge on lumped elements, the book is an indispensable professional reference and serves as an excellent text for senior undergraduate and graduate-level courses in RF and microwave circuit design.
Introduction - History of Lumped Elements. Why Lumped Elements for RF and Microwave Circuits. L, C, R Circuit Elements. Basic Design of Lumped Elements. Lumped Element Modeling. Fabrication. Applications.; Inductors - Basic Definitions. Inductor Models. Coupling Between Inductors. Electrical Representations.; Printed Inductors - Inductors on Si Substrate. Inductors on GaAs Substrate. Printed Circuit Board Inductors. Hybrid Integrated Circuit Inductors. Ferromagnetic Inductor.; Wire Inductors - Wire-Wound Inductors. Bond Wire Inductor. Wire Models. Magnetic Materials.; Capacitors -Introduction. Capacitor Parameters. Chip Capacitor Types. Discrete Parallel Plate Capacitor Analysis. Voltage and Current Ratings. Capacitor Electrical Representation.; Monolithic Capacitors - Capacitor Models. High Density Capacitors. Capacitor Shapes.; Interdigital Capacitors - Interdigital Capacitor Model. Design Considerations. Interdigital Structure as a Photodetector.; Resistors -Introduction. Definitions. Resistor Types. High Power Resistor Models. Resistor Representations. Effective Conductivity. Thermistors.; Via Hole - Types of Via. Via Hole Models. Via Hole Design Considerations. Plate Heat Sink Via. Via Hole Layout.; Airbridge and Dielectric Crossover - Types of Airbridge and Crossover. Analysis Techniques. Models. Design Considerations.; Inductor Transformers - Basic Theory. Wire Wrapped Transformers. Transmission-Line Transformers. Ferrite Transformers. Parallel Conductor Winding Transformers on Si Substrate. Spiral Transformers on GaAs Substrate.; Fabrication Technologies -Introduction. Printed Circuit Boards. Microwave Printed Circuits. Hybrid Microwave Integrated Circuits. Monolithic Integrated Circuits Device Technologies. CMOS Fabrication. Micromachining Fabrication.; Lumped Element Circuits - Passive Components. Solid State Passive Circuits. Solid State Active Circuits.; Microstrip Overview - Design Equations. Design Considerations. Microstrip Coupled Lines. Microstrip Discontinuities. Compensated Microstrip Discontinuities.;
  • Inder J. Bahl Inder J. Bahl is an IEEE Fellow and a member of the Electromagnetic Academy. He is the editor of the Int. Journal of RF and Microwave Computer-Aided Engineering. He earned his Ph.D. in electrical engineering and has over 40 years of experience working in the microwave field.
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