Description
Featuring invaluable input from industry-leading companies and highly-regarded experts in the field, this first-of-its kind resource offers you a comprehensive understanding of advanced topics in RF, SiP (system-in-package), and SoC (system-on-a-chip) production testing and the peripheral testing needs and equipment that are critical to your work involving semiconductor devices. The book covers the key measurement concepts you need to understand for your varied projects and helps you explain these concepts to management to aid in the reduction of project cost, time, and resources. Moreover, you find practical information on important associated topics that have never been presented in a single reference before, including load boards (DIBs), contactors, and handlers. Based on real-world experience and packed with time-saving equations, this in-depth volume provides you with detailed discussions in a wide range of essential areas, from applied tests for RF and SOC Devices and advances in these devices, to applications, calibration, and test costs. The book serves as an excellent complement to Production Testing of RF & System-on-Chip Devices for Wireless Communications (Artech House, 2004).
Table Of Contents
Introduction. Production Testing Equipment. Applied Tests for RF and SOC Devices. Advances in Testing RF and SOC Devices. Applications. Calibration. Cost of Test. Load Boards. Test Sockets and Contractors. Handlers. Wafer Probing.
Author
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Michael Engelhardt
Michael D. Engelhardt is a senior RF applications engineer at Agilent Technologies. He holds an M.S. in electrical engineering from the University of Ulm, Germany and an M.B.A. from the University of Dallas. Mr. Engelhardt has written several papers for major international conferences.