Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Table Of Contents
MEMS: A Technology from Lilliput - The Promise of Technology. What are MEMS? What is Micromachining? Applications and Markets. To MEMS or not to MEMS. Standards. The Psychological Barrier. Journals, Conferences, and Web Sites. The Sandbox: Materials for MEMS - Silicon Materials. Other Materials and Substrates. Important Material Properties and Physical Effects. The Toolbox: Processes for Micromachining - Basic Process Tools. Advanced Process Tools. Combining the Tools.; MEM Structure and Systems in Industrial and Automotive Applications - General Design Methodology. Techniques for Sensing and Actuation. Passive MEM Structures. Sensors. Actuators. MEM Structures and Systems for Photonic Applications - Imaging and Displays. Fiber-Optic Communication Devices.; MEM Structures and Systems for Medical Applications.; MEM Structures and Systems for Electronic and RF Applications.; Packaging & Reliability for MEMS - Key Design and Packaging Considerations. Die-Attach Processes. Wiring and Interconnects. Types of Packaging Solutions. Reliability and Failure Analysis. Glossary. ;
Nadim Maluf is Executive Vice President of LumaSense Technologies and a consulting professor of Electrical Engineering at Stanford University. Prior to LumaSense, he was vice president of New Focus, and head of research and development at NovaSensor, now part of GE. A best-selling author in the area of MEMS technology, Dr. Maluf earned his Ph.D. in electrical engineering at Stanford University and his M.S. in electrical engineering at the California Institute of Technology.
Kirt Williams is a senior scientist at Science Applications International Corporations. Formerly, he was a member of the technical staff at Agilent Technologies. He received his Ph.D. and M.S. in electrical engineering from the University of California at Berkeley. He is the author of numerous papers on MEM devices and fabrication processes.