By (author): Eric Bogatin

Copyright: 2021
Pages: 500
ISBN: 9781630819620

Artech House is pleased to offer you this title in a special In-Print-Forever® ( IPF® ) hardbound edition. This book is not available from inventory but can be printed at your request and delivered within 2-4 weeks of receipt of order. Please note that because IPF® books are printed on demand, returns cannot be accepted.

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Printed circuit boards (PCB) are at the heart of every electronic product manufactured today. Yet, engineers rarely learn to design PCBs from a class or course. They learn it by doing, by reading app notes, watching YouTube videos and sitting by the side of an experienced engineer.


This book is the foundation building book for all engineers starting out to design PCBs. It teaches good habits designing a PCB, first for connectivity, and secondly, introduces the four most important principles to reduce noise.


A seven-step process is presented: developing a plan of record, creating a Bill of Materials, completing the schematic, completing the layout, completing the assembly, conducting bring up and troubleshooting and documenting the project. Each step is developed in detail. In particular, the emphasis in this book is on risk management: what can be done at each step of the process to reduce the risk of a hard-error which requires a complete re-spin, or a soft error, which requires some sort of on-the-fly repair.


After connectivity is designed, it’s important to develop good habits to minimize the potential noise from ground bounce, power rail stitching noise, stack up design and reducing switching noise in signal paths. These techniques apply to all designs from 2-layer to 8-layer and more, for bandwidths below 200 MHz.


The best practices for manual lead-free soldering are presented so that everyone can become a soldering expert.


The best measurement practices using common lab instruments such as the DMM, the constant current/constant voltage power supply, and oscilloscopes are presented so that common artifacts are minimized. Features in the design that help you find design or assembly errors quickly and the troubleshooting techniques to find and fix problems are introduced.


Applying the habits presented in this book will help every engineer design their next circuit board faster, with less chance of an unexpected problem, with the lowest noise. This textbook will also have embedded videos to visually demonstrate many of the hands-on processes introduced in this book.

Table Of Contents

A Getting Started Guide; PCB Technology; Signal Integrity and Interconnects; Electrical Properties of Interconnects; Trace Width Considerations: Max Current; Trace Width Considerations: Series Resistance; The Seven Steps in Creating a PCB; Step 1- POR: Risk mitigation; Risk Reduction: Datasheets, Reverse Engineering and Component Selection; Risk Reduction: Virtual and Real Prototypes; Risk Reduction: Prototyping with a Solderless Breadboard; Switching Noise and Return Path Routing; Power Delivery; Design for Performance: The PDN on a PCB; Risk Reduction: Design for Bring up; Risk Reduction: Design Reviews; Step 2: Surface Mount or Through Hole Parts; Finding the 1 part in a million; Step 3: Schematic Capture and Final BOM; Step 4: Layout- Setting up the Board; Floor Planning and Routing Priority; Six Common Misconceptions About Routing; Four-layer Boards; Release the Board to the Fab Shop; Step 6- Bring Up; Step 7: documentation; Concluding Comments; About Eric Bogatin.


  • Eric Bogatin

    is currently a Signal Integrity Evangelist with Teledyne LeCroy and the Dean of the Teledyne LeCroy Signal Integrity Academy, at Additionally, he is an Adjunct Professor at the University of Colorado - Boulder in the ECEE dept, and technical editor of the Signal Integrity Journal. He received his Ph.D. in physics from the University of Arizona. He has written six technical books in the field and presented classes and lectures on signal integrity world wide.