By (author)s: Bo Pan, Guoan Wang
Description
Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.
Table Of Contents
Introduction; Overview of RF Passives and Enabling Materials - Passive Filters. Combiners, Dividers, Hybrids, and Couplers. Inductors, Transformers, and Baluns. Antennas. Summary.; Novel Flexible Material Liquid Crystal Polymer (LCP) Based Flexible Passives -Introduction. LCP Properties. Multilayer LCP Process Development. Design and Fabrication of LCP-based Tunable RF Passive. LCP for 3D Integration and Packaging. Summary.; Ferroelectric-based Tunable RF Capacitor -Introduction. BST Materials for RF Capacitors. Ferroelectric Capacitor with Low Tuning Voltage and High Linearity. Low Conductor Loss Capacitor. Embedded Ferroelectric Capacitor. Summary. Future Prospects.; High Aspect Ratio RF Passives Enabled by Smart RF Materials and Polymer-core Conductor Micromachining Technologies -Introduction. Properties of SU-8 Polymer. TheIntroduction of Polymer-core Conductor Micromachining Technology. High-Q RF Inductors by This Approach. High-performance Millimeter-wave Antennas Using the Polymer-core Conductor Approach. High-aspect-ratio Micromachined Filters, Duplexer, and Coupler. Summary.; CNT-based Passive Circuits and Detectable Components -Introduction. CNT-based Transmission Line and Interconnect. CNT-based Flexible and Pattern-Agile Antennas. CNT-based RF Wireless Transducer. Summary.; Paper-based Green RFID and Other Passives -Introduction. RFID and Its Applications. Paper-based Green RFID. Smart RFID. Summary.; Flexible Magnetic Composites -Introduction. Flexible Magnetic Composites. Flexible Magnetic Composites for Biomonitoring Applications. Summary.; Composite Right-/Left-handed Metamaterials and Their RF Applications -Introduction. Left-handed Metamaterials and Basic Concepts. Transmission-line Approach. Zeroth-order Resonators with Double Resonances and Their Applications to Polarization-controllable Antennas. Nonreciprocal Metamaterials and Their Applications to Traveling-wave Resonators and Beam-steering Antennas. Summary.; Designing Novel On-chip Millimeter Wave Passives -Introduction to On-chip Novel Passive Device Design. Tunable Delay Transmission Line with Fixed Characteristic Impedance. Two-state Single-turn Spiral Inductor of Reconfigurable RF Circuits. On-chip Frequency-dependent Inductor for Multi-band Circuit Designs. Through-silicon-via (TSV) MMW Passives for 3D Package Environment. Summary.; About the Authors. Index.;
Author
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Bo Pan
Bo Pan is a senior RF engineer at Realtek Semiconductor Corporation in Irvine, California. He holds an M.S. in electrical engineering from Tsinghua University and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.
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Guoan Wang
Guoan Wang is an advisory engineer/scientist at the IBM Semiconductor Research and Development Center in Essex Junction, Vermont. He holds an M.S. in materials science and engineering from Zhejiang University, an M.S. in electrical engineering from Arizona State University, and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.