This book discusses the basic principles, key issues, existing technologies, problems and future trends of sensor technology. It focuses on the four important areas of microsensor engineering: modelling, technology, devices and applications and integration.
Modeling and Simulation of Microsensors and Actuators. Bulk Micromachining Technology. Surface Micromachining Technology. Silicon Direct Wafer Bonding. Packaging for Sensors. Magnetic Field Sensors Based on Lateral Magnetotransistors. Thermal Sensors. Planar Silicon Photosensors. Charged Coupled Devices. Sensors for the Automotive Industry. Signal Processing for Micromachined Sensors. Controlled Oscillators and their Applicability to Sensors.
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William C. Dunn
William C. Dunn worked in various key management roles for the Motorola Semiconductor Products Sector for over 10 years. Now semi-retired, Mr. Dunn is an adjunct instructor at Ouachita Technical College, teaching digital logic and industrial instrumentation. A well-published author, he holds more than 25 patents and has presented at several major industry conferences.
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Ljubisa Ristic