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Artech House USA
Substrate Integrated Suspended Line Circuits and Systems

Substrate Integrated Suspended Line Circuits and Systems

By (author)s: Kaixue Ma, Yongqiang Wang
Copyright: 2024
Pages: 296
ISBN: 9781685690298
Coming Soon: Available 03/31/2024

Hardback $129.00 Qty:

Substrate Integrated Suspended Line Circuits and Systems provides a systematic overview of the new transmission line - the substrate-integrated suspension line (SISL). It details the fundamentals and classical application examples of the SISL. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems are systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideal for researchers, engineers, scientists, scholars, educators, and students.

 

Since transmission line is a fundamental component of microwave and mm-wave circuits, the properties of a transmission line, such as losses, size, and dispersion, are vital to the performance of the whole system. Suspended line has been proved to be an excellent transmission line, as it has attractive features such as low loss, weak dispersion, high power capacity, and low effective dielectric constant. However, Conventional waveguide suspended line circuits require metal housing to form air cavities which is Substrate Integrated Suspended Line Circuits and Systems essential to the operation of suspended lines circuits. Also, the metal shell should provide mechanical support and shielding, which contribute to large size and heavy weight. Meanwhile, precise mechanical fabrication and assembling are strongly required, which brings difficulties to the design and fabrication of conventional suspended line circuits, and the manufacturing cost of suspended line circuits increases correspondingly.

 

In this book, we will introduce a new platform of high-performance transmission line, i.e. substrate integrated suspended line (SISL). SISL keeps all the merits of the suspended line while overcomes the drawbacks of conventional waveguide suspended line circuits. Moreover, it is self-packaged and highly integrated. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems will be systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideally designed for researchers, engineers, scientists, scholars, educators, and students.

  • Kaixue Ma

    received B.E. and M.E. degrees from Northwestern Polytechnical University (NWPU), Xi’an, China, and Ph.D. degree from Nanyang Technological University (NTU), Singapore. From 1997 to 2002, he worked in Chinese Academy of Space Technology (Xi’an) as a group leader. From 2005 to 2007, he was with MEDs Technologies as an R&D Manager. From 2007 to 2010, he was with ST Electronics as R&D manager, Project Leader, technique management Committee and technique consultant in 2011.

     

    From 2010 to 2013, he was with NTU as a Senior Research Fellow and millimetre-wave RFIC team leader for 60-GHz Flagship Chipset project. From 2013 to 2018, He is Full Professor with the University of Electronic Science and Technology of China (UESTC), Chengdu, China. Since Feb. 2018, he has been the Dean and Professor of the School of Microelectronics of Tianjin University, PI of National IC Innovation & Entrepreneurship Platform of Tianjin, the Director of Tianjin Key Laboratory of Imaging and Sensing Microelectronics Technology and the Chairperson of Tianjin IC Association. Dr. Ma proposed a variety of RF and microwave integrated circuits based on advanced CMOS, SiGe BiCMOS, GaAs and SOI technologies, and microwave circuit and system design technology patented with “quasi-planar circuits with embedded air cavity” named as SISL in publication.

     

    He was responsible for designing the first low-power reconfigurable 60 GHz SiGe millimetre-wave transceiver SOC, packaging and system testing, and completed a high-speed dual-chip wireless communication system. He is currently working on silicon-based and GaAs RF millimeter-wave integrated circuits and systems. He has filed 50 patents, published two books, over 170 SCI international Journal papers (over 140 IEEE journal articles) and 180 international conference papers. Dr. Ma is Fellow of Chinese Institute of Electronics and awardee of the Chinese National Science Fund for Distinguished Young Scholars. He received 10 technique awards including best paper award etc.

     

    He was Associate Editor for the IEEE Transactions on Microwave Theory and Techniques and Guest Editor of IEEE Microwave Magazine and current Member and he organizers for international conferences. He is the Coordinator IEEE MTT-S R10 for China and Singapore and current member and Speakers Bureau of MTT-S TC-4 etc.

  • Yongqiang Wang

    received the B.S. and Ph.D. degrees from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2014 and 2019, respectively.

     

    From 2019 to 2020, he was a research associate with The Chinese University of Hong Kong, Hong Kong. He is currently a full-time Associate Professor with the School of Microelectronics, Tianjin University, Tianjin, China. His current research interest includes microwave passive circuit design and its applications. Dr. Wang has authored or co-authored over 60 journals and conference articles and holds 14 patents granted. Dr. Wang was the finalist in the Student Innovation Competition of iWEM in 2014, the Advanced Practice Paper Competition (APPC) of IEEE MTTS IMS in 2017, and IWS in 2019. He was a recipient of the Best Student Paper of UCMMT2018, NCMMW2017, and NCMMW2019, where he twice received the Excellent Paper Award supported by the Education Development Foundation of Lin Weigan.

     

    He is a reviewer for the IEEE Transactions on microwave theory and techniques, IEEE transactions on industrial electronics, IEEE transactions on circuits and systems I: regular papers, IEEE transactions on antennas and propagation, IEEE transactions on components, packaging and manufacturing technology, IEEE transactions on electron devices, IEEE microwave and wireless components letters, IET microwaves, antennas and propagation, and electronics letters.

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